Method for manufacturing pillar-shaped semiconductor device

ABSTRACT

A band-shaped Si pillar having a mask material layer on the top portion thereof is formed on a P+ layer. SiGe layers having mask material layers on the top portions thereof are then formed in contact with the side surfaces of the band-shaped Si pillar and the surfaces of N+ layers and the P+ layer. Si layers having mask material layers on the top portions thereof are then formed in contact with the side surfaces of the SiGe layers and the surfaces of the N+ layers. The outer peripheries of the bottom portions of the Si layers are then removed using the mask material layers as a mask to form band-shaped Si pillars. The mask material layers and the SiGe layers are then removed. Si pillars separated in the Y direction are then formed in the band-shaped Si pillars.

CROSS REFERENCES TO RELATED APPLICATIONS

The present application is a continuation application of PCT/JP2018/036643, filed Oct. 1, 2018, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to methods for manufacturing pillar-shaped semiconductor devices.

Description of the Related Art

Recently, three-dimensional-structure transistors have been used for large-scale integration (LSI). Of these, surrounding gate transistors (SGTs), which are pillar-shaped semiconductor devices, have attracted attention as semiconductor elements that provide semiconductor devices with high levels of integration. In addition, there is a need for a semiconductor device having an SGT with a higher level of integration and a higher performance.

A typical planar MOS transistor has a channel extending in the horizontal direction along the upper surface of a semiconductor substrate. In contrast, an SGT has a channel extending in a direction perpendicular to the upper surface of a semiconductor substrate (see, for example, Japanese Unexamined Patent Application Publication No. 2-188966 and Hiroshi Takato, Kazumasa Sunouchi, Naoko Okabe, Akihiro Nitayama, Katsuhiko Hieda, Fumio Horiguchi, and Fujio Masuoka, IEEE Transaction on Electron Devices, Vol. 38, No. 3, pp. 573-578 (1991)). Thus, SGTs provide a higher density of semiconductor devices than planar MOS transistors.

FIG. 7 shows a schematic structural view of an N-channel SGT. A Si pillar 100 (silicon semiconductor pillars are hereinafter referred to as “Si pillar”) whose conductivity type is P-type or i-type (intrinsic) has N+ layers 101 a and 101 b (semiconductor regions containing donor impurities in high concentrations are hereinafter referred to as “N+ layer”) formed in the upper and lower portions of the Si pillar 100, one serving as the source and the other serving as the drain. The portion of the Si pillar 100 between the N+ layers 101 a and 101 b, which serve as the source and the drain, forms a channel region 102. A gate insulating layer 103 is formed so as to surround the channel region 102. A gate conductor layer 104 is formed so as to surround the gate insulating layer 103. In the SGT, the N+ layers 101 a and 101 b, which serve as the source and the drain, the channel region 102, the gate insulating layer 103, and the gate conductor layer 104 are formed so as to have a pillar shape as a whole. Hence, in plan view, the area occupied by the SGT corresponds to the area occupied by a single source or drain N+ layer of a planar MOS transistor. Thus, a circuit chip having SGTs can achieve a smaller chip size than a circuit chip having planar MOS transistors.

There is a need for a circuit having SGTs shown in FIG. 7 with a higher level of integration.

Another example of the related art is disclosed in C. Y. Ting, V. J. Vivalda, and H. G. Schaefer, “Study of Planarized Sputter-Deposited SiO2”, J. Vac. Sci. Technol. 15(3), pp. 1105-1112, May/June (1978).

SUMMARY OF THE INVENTION

There is a need to achieve a higher density of pillar-shaped semiconductor devices.

Solution to Problem

A method for manufacturing a pillar-shaped semiconductor device according to an aspect of the present invention includes the steps of:

forming a first mask material layer extending in a band shape in one direction in plan view on a semiconductor layer on a substrate;

etching the semiconductor layer using the first mask material layer as a mask to form a first band-shaped semiconductor pillar;

forming a first material layer so as to cover the first mask material layer, the first band-shaped semiconductor pillar, and a portion of the substrate around an outer periphery of the first band-shaped semiconductor pillar;

forming a second material layer so as to cover the first material layer;

planarizing the first material layer and the second material layer such that upper surfaces thereof are located at the same height as an upper surface of the first mask material layer;

etching a top portion of the first material layer using the first mask material layer and the second material layer as a mask to form first recesses;

forming a second mask material layer so as to fill the first recesses above the top portion of the first material layer and such that an upper surface of the second mask material layer is located at the same height as the upper surface of the first mask material layer;

removing the second material layer;

etching the first material layer using the first mask material layer and the second mask material layer as a mask to form a first band-shaped material pillar and a second band-shaped material pillar based on the first material layer on both sides of the first band-shaped semiconductor pillar in plan view;

forming a first semiconductor layer so as to cover the first mask material layer, the second mask material layer, the first band-shaped semiconductor pillar, the first band-shaped material pillar, the second band-shaped material pillar, and the substrate;

forming a third material layer so as to cover the first semiconductor layer;

planarizing the first semiconductor layer and the third material layer such that upper surfaces thereof are located at the same height as the upper surface of the first mask material layer;

etching a top portion of the first semiconductor layer using the first mask material layer, the second mask material layer, and the third material layer as a mask to form second recesses;

forming a third mask material layer so as to fill the second recesses above the top portion of the first semiconductor layer and such that an upper surface of the third mask material layer is located at the same height as the upper surface of the first mask material layer;

removing the third material layer;

etching the first semiconductor layer using the first mask material layer, the second mask material layer, and the third mask material layer as a mask to form a second band-shaped semiconductor pillar and a third band-shaped semiconductor pillar based on the first semiconductor layer outside the first band-shaped material pillar and the second band-shaped material pillar in plan view;

removing the first band-shaped material pillar and the second band-shaped material pillar;

forming a fourth material layer around outer peripheries of the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar such that an upper surface of the fourth material layer is located at the same height as the upper surface of the first mask material layer;

forming a fourth mask material layer extending in a band shape on the first mask material layer, the third mask material layer, and the fourth material layer in a direction perpendicular to the direction in which the first mask material layer extends in a band shape in plan view; and

etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using the fourth mask material layer as a mask to form a first semiconductor pillar, a second semiconductor pillar, and a third semiconductor pillar,

wherein pillar-shaped semiconductor devices having channels in the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar are formed.

More preferably, the second band-shaped semiconductor pillar and the third band-shaped semiconductor pillar are formed from a second semiconductor base different from a first semiconductor base for the first band-shaped semiconductor pillar.

More preferably, one of the first mask material layer and the second mask material layer is formed so as to be wider than the other in plan view.

More preferably, one of the first mask material layer and the third mask material layer is formed so as to be wider than the other in plan view.

More preferably, one of the first mask material layer and the fourth mask material layer is formed so as to be wider than the other in plan view.

More preferably, the method for manufacturing a pillar-shaped semiconductor device includes the steps of:

forming a gate insulating layer so as to surround side surfaces of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar; and

forming a gate conductor layer so as to surround the gate insulating layer,

wherein the gate conductor layer is formed so as to fill spaces between the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar.

More preferably, a semiconductor layer containing a donor or acceptor impurity is formed by epitaxial growth, the semiconductor layer covering top portions of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar, or having a lower end thereof located at an upper portion of the gate conductor layer in a perpendicular direction and being in contact with and connected to the side surfaces of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar.

More preferably, the method for manufacturing a pillar-shaped semiconductor device includes the steps of:

forming a fifth material layer around the outer peripheries of the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar such that an upper surface of the fifth material layer is located at the same height as the upper surface of the first mask material layer;

forming a third band-shaped material pillar having a fifth mask material layer on a top portion thereof on the first mask material layer, the third mask material layer, and the fifth material layer, the third band-shaped material pillar being perpendicular to the first band-shaped semiconductor pillar in plan view;

forming a fourth band-shaped material pillar having a sixth mask material layer on a top portion thereof on one side of the third band-shaped material pillar and a fifth band-shaped material pillar having a seventh mask material layer on a top portion thereof on the other side of the third band-shaped material pillar;

removing the fifth mask material layer and the third band-shaped material pillar; and

etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using one or both of the sixth mask material layer and the fourth band-shaped material pillar as a mask to form the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar

while etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using one or both of the seventh mask material layer and the fifth band-shaped material pillar as a mask to form a fourth semiconductor pillar, a fifth semiconductor pillar, and a sixth semiconductor pillar in regions where the seventh mask material layer intersects the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar in plan view,

wherein the sixth mask material layer and the seventh mask material layer have the same width in plan view.

The present invention provides high-density pillar-shaped semiconductor devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1AA to 1AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a first embodiment.

FIGS. 1BA to 1BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1CA to 1CC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1DA to 1DC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1EA to 1EC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1FA to 1FC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1GA to 1GC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1HA to 1HC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1IA to 1IC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1JA to 1JC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1KA to 1KC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1LA to 1LC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1MA to 1MC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1NA to 1NC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1OA to 1OC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1PA to 1PC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1QA to 1QC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1RA to 1RC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1SA to 1SC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1TA to 1TC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 1UA to 1UC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the first embodiment.

FIGS. 2AA to 2AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a second embodiment of the present invention.

FIGS. 2BA to 2BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the second embodiment.

FIGS. 2CA to 2CC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the second embodiment.

FIGS. 3AA to 3AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a third embodiment of the present invention.

FIGS. 3BA to 3BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the third embodiment of the present invention.

FIGS. 3CA to 3CC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the third embodiment of the present invention.

FIGS. 3DA to 3DC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the third embodiment of the present invention.

FIGS. 4AA to 4AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a fourth embodiment of the present invention.

FIGS. 4BA to 4BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the fourth embodiment of the present invention.

FIGS. 5AA to 5AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a fifth embodiment of the present invention.

FIGS. 5BA to 5BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the fifth embodiment of the present invention.

FIGS. 5CA to 5CC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the fifth embodiment of the present invention.

FIGS. 6AA to 6AC are a plan view and sectional structural views illustrating a method for manufacturing a pillar-shaped semiconductor device having an SGT according to a sixth embodiment.

FIGS. 6BA to 6BC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the sixth embodiment.

FIGS. 6CA to 6CC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the sixth embodiment.

FIGS. 6DA to 6DC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the sixth embodiment.

FIGS. 6EA to 6EC are a plan view and sectional structural views illustrating the method for manufacturing a pillar-shaped semiconductor device having an SGT according to the sixth embodiment.

FIG. 7 is a schematic structural view showing a conventional example of an SGT.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Methods for manufacturing pillar-shaped semiconductor devices according to embodiments of the present invention will hereinafter be described with reference to the drawings.

First Embodiment

A method for manufacturing an SRAM cell circuit as a pillar-shaped semiconductor device having an SGT according to a first embodiment of the present invention will hereinafter be described with reference to FIGS. 1AA to 1UC, where the figures with the suffix A show plan views, the figures with the suffix B show sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix C show sectional structural views taken along line Y-Y′ of the figures with the suffix A.

As shown in FIGS. 1AA to 1AC, an N layer 2 is formed on a P-layer substrate 1 by epitaxial crystal growth. N+ layers 3 and 5 and a P+ layer 4 are then formed in the surface layer of the N layer 2 by ion implantation. An i layer (intrinsic Si layer) 7 is then formed. A mask material layer 6 composed of, for example, a SiO2 layer, an aluminum oxide (Al2O3) layer, and a SiO2 layer is then formed. The i layer 7 may also be formed of N-type or P-type Si containing a small amount of donor or acceptor impurity.

Next, as shown in FIGS. 1BA to 1BC, the mask material layer 6 is subjected to lithography and etching to form a mask material layer 6 a extending in the Y direction in plan view. The i layer 7 and the surface layers of the N+ layers 3 and 5 and the P+ layer 4 are then etched using the mask material layer 6 a as an etching mask to form a band-shaped Si pillar 8. N+ layers 3 a and 5 a and a P+ layer 4 a are formed on the N layer 2.

Next, as shown in FIGS. 1CA to 1CC, a SiGe layer 10 is formed so as to cover the band-shaped Si pillar 8, the N+ layers 3 a and 5 a, and the P+ layer 4 a by atomic layer deposition (ALD).

Next, as shown in FIGS. 1DA to 1DC, the entire surface is covered with a SiO2 layer (not shown), for example, by flow chemical vapor deposition (flow CVD). The SiO2 layer and the SiGe layer 10 are then polished by chemical mechanical polishing (CMP) such that the upper surfaces thereof are located at the same height as the upper surface of the mask material layer 6 a, thereby forming a SiO2 layer 11 and SiGe layers 10 a and 10 b. In this case, it is desirable that the side surfaces of the top portions of the SiGe layers 10 a and 10 b be perpendicular. Accordingly, it is desirable that rounded corners R of the top portion of the SiGe layer 10 in FIGS. 1CA to 1CC be removed in the step of polishing the SiO2 layer and the SiGe layer 10.

Next, as shown in FIGS. 1EA to 1EC, the top portions of the SiGe layers 10 a and 10 b are etched using the SiO2 layer 11 and the mask material layer 6 a as a mask to form recesses 12 a and 12 b. It is desirable that the top portions of the SiGe layers 10 a and 10 b be polished such that the bottom portions of the recesses 12 a and 12 b are located at the same height as the lower portion of the mask material layer 6 a. Since the rounded corners R of the top portion of the SiGe layer 10 in FIGS. 1CA to 1CC have been removed in the step of polishing the SiO2 layer and the SiGe layer 10, recesses 12 a and 12 b having perpendicular outer peripheral side surfaces are formed.

Next, as shown in FIGS. 1FA to 1FC, the entire surface is covered with a SiN layer (not shown), and the SiN layer is polished over the entire surface by CMP such that the upper surface thereof is located at the same height as the upper surface of the mask material layer 6 a. The SiO2 layer 11 outside the SiGe layers 10 a and 10 b in plan view is then removed. Thus, SiN layers 13 a and 13 b having the same shape as the top portions of the SiGe layers 10 a and 10 b in plan view are formed on both sides of the mask material layer 6 a and the band-shaped Si pillar 8.

Next, as shown in FIGS. 1GA to 1GC, the SiGe layers 10 a and 10 b outside the SiN layers 13 a and 13 b in plan view are etched using the SiN layers 13 a and 13 b as a mask. Thus, band-shaped SiGe layers 10 aa and 10 bb having the same width in plan view are formed on both sides of the band-shaped Si pillar 8.

Next, as shown in FIGS. 1HA to 1HC, a Si layer 15 is formed so as to cover the entire surface by Si ALD. The Si layer 15 may also be a layer containing a slight amount of donor or acceptor impurity.

Next, a SiO2 layer (not shown) is formed so as to cover the Si layer 15. The SiO2 layer and the Si layer 15 are then polished such that the upper surfaces thereof are located at the same height as the upper surface of the mask material layer 6 a, thereby forming a SiO2 layer 11 a and Si layers 15 a and 15 b. As shown in FIGS. 1IA to 1IC, the top portions of the Si layers 15 a and 15 b are then etched using the mask material layers 6 a, 13 a, and 13 b and the SiO2 layer 11 a as a mask to form band-shaped recesses 12 c and 12 d.

Next, as shown in FIGS. 1JA to 1JC, band-shaped SiO2 layers 16 a and 16 b are formed so as to fill the recesses 12 c and 12 d. Thus, band-shaped SiO2 layers 16 a and 16 b having the same width in plan view and Si layers 15 a and 15 b disposed under the band-shaped SiO2 layers 16 a and 16 b and extending over the N+ layers 3 a and 5 a are formed on both sides of the SiN layers 13 a and 13 b and the band-shaped SiGe layers 10 aa and 10 bb.

Next, as shown in FIGS. 1KA to 1KC, the SiO2 layer 11 a is removed.

Next, as shown in FIGS. 1LA to 1LC, the Si layers 15 a and 15 b are etched using the mask material layers 16 a and 16 b, which are formed of a SiO2 layer, as a mask to form band-shaped Si pillars 15 aa and 15 bb. It is desirable that the Si layers 15 a and 15 b be etched down to the upper surfaces of the N+ layers 3 a and 5 a. The SiN layers 13 a and 13 b and the SiGe layers 10 aa and 10 bb outside the Si pillar 8 are then removed. Thus, band-shaped Si pillars 15 aa and 15 bb separated from the band-shaped Si pillar 8 by the same distance and having the same width are formed on both sides of the band-shaped Si pillar 8. The mask material layers 16 a and 16 b are left on the band-shaped Si pillars 15 aa and 15 bb.

Next, as shown in FIGS. 1MA to 1MC, a thin protective material layer 18 composed of a SiO2 layer and a SiN layer is formed over the entire surface by ALD. The entire surface is then covered with a SiO2 layer (not shown), and the SiO2 layer is polished by CMP such that the upper surface thereof is located at the same height as the upper surface of the protective material layer 18 on the mask material layer 6 a and the mask material layers 16 a and 16 b, thereby forming a SiO2 layer 19 around the outer peripheries of the band-shaped Si pillars 8, 15 aa, and 15 bb. A mask material layer (not shown) composed of a SiN layer and a SiO2 layer is uniformly formed over the entire surface. The mask material layer is then subjected to lithography and etching to form band-shaped mask material layers 20 a and 20 b on the mask material layer 6 a, the mask material layers 16 a and 16 b, and the SiO2 layer 19 in a direction perpendicular to the direction in which the mask material layer 6 a extends in a band shape in plan view.

Next, as shown in FIGS. 1NA to 1NC, the SiO2 layer 19, the protective material layer 18, the mask material layers 6 a, 16 a, and 16 b, and the band-shaped Si pillars 8, 15 aa, and 15 bb are etched using the mask material layers 20 a and 20 b as a mask. Thus, Si pillars 22 a and 22 d are formed on the N+ layer 3 a, Si pillars 22 b and 22 e are formed on the P+ layer 4 a, and Si pillars 22 c and 22 f are formed on the N+ layer 5 a. A mask material layer 16 aa is formed on the Si pillar 22 a. A mask material layer 6 aa is formed on the Si pillar 22 b. A mask material layer 16 ba is formed on the Si pillar 22 c. A mask material layer 16 ab (not shown) is formed on the Si pillar 22 d. A mask material layer 6 ab is formed on the Si pillar 22 e. A mask material layer 16 bb (not shown) is formed on the Si pillar 22 f. A protective material layer 18 a is formed under the band-shaped mask material layer 20 a in plan view so as to cover the top portions and side surfaces of the Si pillars 22 a, 22 b, and 22 c and so as to be connected to the upper surfaces of the N+ layer 3 a, the P+ layer 4 a, and the N+ layer 5 a. A protective material layer 18 b is formed under the band-shaped mask material layer 20 b in plan view so as to cover the top portions and side surfaces of the Si pillars 22 d, 22 e, and 22 f and so as to be connected to the upper surfaces of the N+ layer 3 a, the P+ layer 4 a, and the N+ layer 5 a. A SiO2 layer 19 a is formed under the band-shaped mask material layer 20 a outside the Si pillars 22 a, 22 b, and 22 c in plan view so as to cover the protective material layer 18 a. Similarly, a SiO2 layer 19 b (not shown) is formed under the band-shaped mask material layer 20 b outside the Si pillars 22 d, 22 e, and 22 f in plan view so as to cover the protective material layer 18 b.

Next, as shown in FIGS. 1OA to 1OC, the band-shaped mask material layers 20 a and 20 b, the SiO2 layers 19 a and 19 b, and the protective material layers 18 a and 18 b are removed. A SiO2 layer (not shown) is then formed in the side surfaces of the Si pillars 22 a to 22 f by isotropic oxidation. The SiO2 layer is then removed. Thus, the Si pillars 22 a to 22 f have a circular cross-section in plan view.

Next, as shown in FIGS. 1PA to 1PC, SiN layers 25 a, 25 b, 25 c, 25 d (not shown), 25 e, and 25 f (not shown) surrounding the side surfaces of the mask material layers 16 aa, 6 aa, 16 ba, 16 ab, 6 ab, and 16 bb and SiO2 layers 28 a, 28 b, 28 c, 28 d (not shown), 28 e, and 28 f (not shown) surrounding the side surfaces of the Si pillars 22 a to 22 f are formed. The entire surface is then covered with a SiO2 layer (not shown), and the SiO2 layer is polished by CMP such that the upper surface thereof is located at the same height as the upper surfaces of the mask material layers 16 aa, 6 aa, 16 ba, 16 ab, 6 ab, and 16 bb. A mask material layer 26 a composed of a SiN layer and a SiO2 layer and connected to the Si pillars 22 a and 22 b in plan view, a mask material layer 26 b connected to the Si pillars 22 b and 22 c, a mask material layer 26 c connected to the Si pillars 22 d and 22 e, and a mask material layer 26 d connected to the Si pillars 22 e and 22 f are then formed on the SiO2 layer. The SiO2 layer, the N+ layer 3 a, the P+ layer 4 a, the N+ layer 5 a, the N layer 2, and the surface layer of the P layer substrate 1 are then etched using the mask material layers 16 aa, 6 aa, 16 ba, 16 ab, 6 ab, and 16 bb, the SiN layers 25 a to 25 f, and the SiO2 layers 28 a to 28 f as a mask. Thus, the bottom portions of the Si pillars 22 a, 22 b, and 22 c are connected together through an N+ layer 3 aa, a P+ layer 4 aa, and an N+ layer 5 aa. An N layer 2 a is formed under the N+ layer 3 aa, the P+ layer 4 aa, and the N+ layer 5 aa. Similarly, the bottom portions of the Si pillars 22 c, 22 d, and 22 e are connected together through an N+ layer 3 ab, a P+ layer 4 ab, and an N+ layer 5 ab. An N layer 2 b is formed under the N+ layer 3 ab (not shown), the P+ layer 4 ab, and the N+ layer 5 ab (not shown). SiO2 layers 27 a, 27 b, 27 c (not shown), and 27 d (not shown) are formed under the mask material layers 26 a to 26 d.

Next, as shown in FIGS. 1QA to 1QC, the mask material layers 26 a to 26 d are removed. The SiO2 layers 27 a to 27 d are removed. A SiO2 layer 30 is then formed around the outer peripheries of the N+ layers 3 aa, 5 aa, 3 ab, and 5 ab, the P+ layers 4 aa and 4 ab, and the N layers 2 a and 2 b and on the P-layer substrate 1. A HfO2 layer 31 and a TiN layer 32 are then formed so as to cover the entire surface by ALD. A SiO2 layer (not shown) is then formed so as to cover the entire surface by CVD. The SiO2 layer is then polished by CMP such that the upper surface thereof is located at the same height as the upper surface of the TiN layer 32, thereby forming a SiO2 layer 33.

Next, as shown in FIGS. 1RA to 1RC, the entire surface is covered with a W layer. The W layer is then polished by CMP such that the upper surface thereof is located at the same height as the upper surface of the HfO2 layer 31, thereby forming a W layer 34. The top portion of the TiN layer 32 is then etched such that the upper surface thereof is located at the same height as the bottom portions of the mask material layers 16 aa, 6 aa, 16 ba, 16 ab, 6 ab, and 16 bb, thereby forming a TiN layer 32 a. The entire surface is then covered with a SiN layer (not shown). The SiN layer is then polished by CMP such that the upper surface thereof is located at the same height as the upper surface of the HfO2 layer 31, thereby forming SiN layers 35 a, 35 b, 35 c, 35 d (not shown), 35 e, and 35 f (not shown). A mask material layer 36 a composed of a SiN layer and connected to the Si pillars 22 a and 22 b in plan view is then formed. Similarly, a mask material layer 36 b connected to the Si pillar 22 c, a mask material layer 36 c connected to the Si pillar 22 d, and a mask material layer 36 d connected to the Si pillars 22 e and 22 f in plan view are formed.

Next, as shown in FIGS. 1SA to 1SC, the W layer 34 and the TiN layer 32 a are etched using the SiN layers 35 a to 35 f and the mask material layers 16 aa, 6 aa, 16 ab, 16 ba, 6 ab, 16 bb, and 36 a to 36 d as a mask. Thus, a W layer 34 a is formed under the mask material layer 36 a in plan view. Similarly, a W layer 34 b is formed under the mask material layer 36 b, a W layer 34 c (not shown) is formed under the mask material layer 36 c, and a W layer 34 d (not shown) is formed under the mask material layer 36 d. A TiN layer 32 aa is formed around the outer peripheries of the Si pillars 22 a and 22 b so as to overlap the mask material layer 36 a in plan view. A TiN layer 32 ab is formed around the outer periphery of the Si pillar 22 c so as to overlap the mask material layer 36 b in plan view. A TiN layer 32 ba is formed around the outer periphery of the Si pillar 22 d so as to overlap the mask material layer 36 c in plan view. A TiN layer 32 bb is formed around the outer peripheries of the Si pillars 22 e and 22 f so as to overlap the mask material layer 36 d in plan view.

Next, as shown in FIGS. 1TA to 1TC, the entire surface is covered with a SiO2 layer (not shown), and the SiO2 layer is then polished by CMP such that the upper surface thereof is located at the same height as the upper surface of the top portion of the HfO2 layer 31. The SiN layers 35 a to 35 f are then removed. The upper portion of the SiO2 layer is then etched by RIE such that the upper surface thereof is located below the top portions of the Si pillars 22 a to 22 f. The HfO2 layer 31 a covering the mask material layers 16 aa, 6 aa, 16 ba, 16 ab, and 6 ab and the mask material layer 16 aa, 6 aa, 16 ba, 16 ab, 6 ab are then removed. A SiN layer 39 is then formed around the outer peripheries of the top portions of the Si pillars 22 a to 22 f. After the top portions of the Si pillars 22 b and 22 e is covered with a SiO2 layer (not shown), an N+ layer 41 a containing a donor impurity is formed so as to cover the top portion of the Si pillar 22 a by selective epitaxial crystal growth. At the same time, an N+ layer 41 c is formed so as to cover the top portion of the Si pillar 22 c, an N+ layer 41 d (not shown) is formed so as to cover the top portion of the Si pillar 22 d, and an N+ layer 41 f (not shown) is formed so as to cover the top portion of the Si pillar 22 f are formed. After the SiO2 layer covering the top portions of the Si pillars 22 b and 22 e is removed, the N+ layers 41 a, 41 c, 41 d, and 41 f is covered with a SiO2 layer (not shown). P+ layers 41 b and 41 e are then formed so as to cover the top portions of the Si pillars 22 b and 22 e by selective epitaxial crystal growth. The SiO2 layer covering the N+ layer 41 a, 41 c, 41 d, and 41 f is then removed. The donor impurity in the N+ layer 41 a, 41 c, 41 d, and 41 f is then diffused into the top portions of the Si pillars 22 a, 22 c, 22 d, and 22 f by heat treatment to form N+ layers 40 a, 40 c, 40 d (the top portion of the Si pillar 22 d, not shown), and 40 f (the top portion of the Si pillar 22 f, not shown). At the same time, the acceptor impurity in the P+ layers 41 b and 41 e is diffused into the top portions of the Si pillars 22 b and 22 e to form P+ layers 40 b and 40 e.

Next, as shown in FIGS. 1UA to 1UC, a SiO2 layer 43 having a flat upper surface is formed so as to cover the entire surface. Ground line layers VSS1 and VSS2 are then formed through contact holes 44 a and 44 d formed above the N+ layers 41 a and 41 f, and a word line layer WL is formed through contact holes 44 b and 44 c formed above the TiN layers 32Ba and 32Ab. A SiO2 layer 47 having a flat upper surface is then formed so as to cover the entire surface. A power supply line layer VDD is then formed through contact holes 46 a and 46 b formed above the P+ layers 41 b and 41 e. A SiO2 layer 48 having a flat upper surface is then formed so as to cover the entire surface. A bit output line layer BL and an inverted bit output line layer RBL are then formed through contact holes 49 a and 49 b formed above the N+ layers 41 c and 41 d. Thus, an SRAM cell circuit is formed on the P-layer substrate 1.

The method of manufacture according to the first embodiment provides the following features:

1. The band-shaped Si pillar 8 is formed by etching the i layer 7 using the mask material layer 6 a, which is formed by lithography, as an etching mask. The Si pillars 22 b and 22 e are formed from the band-shaped Si pillar 8. On the other hand, the Si pillars 22 a, 22 c, 22 d, and 22 f are formed in the Si layer 15, which is formed so as to cover the entire surface of the band-shaped Si pillar 8, the band-shaped SiGe pillars 10 aa and 10 bb, and the mask material layers 6 a, 13 a, and 13 b shown in FIGS. 1HA to 1HC by Si ALD. The distance between the band-shaped Si pillar 8, 15 aa, and 15 bb is equal to the thickness of the SiGe layers 10 aa and 10 bb, which are formed so as to have the same width on both sides of the band-shaped Si pillar 8 by ALD. Thus, in this embodiment, lithography is used only for the formation of the band-shaped Si pillar 8. Since the SiGe layers 10 aa and 10 bb are formed by ALD, the distance between the band-shaped Si pillars 15 aa, 8, and 15 bb in the X-X′ direction can be made smaller than the minimum patterning size of lithography. Thus, this embodiment provides an SRAM cell with a higher density in the X-X′ direction. The SiGe layer 10 and the Si layer 15 need not be formed by ALD, but may instead be formed by another method such as molecular beam deposition.

2. In this embodiment, the band-shaped Si pillars 15 aa and 15 bb are formed on both sides of the band-shaped Si pillar 8. Thus, three Si pillars 22 a, 22 b, and 22 c arranged in the X direction and three Si pillars 22 d, 22 e, and 22 f arranged in the X direction are formed. On the other hand, after the step in FIGS. 1KA to 1KC, the band-shaped Si pillars 15 aa and 15 bb can be formed, and two band-shaped SiGe layers and two band-shaped Si layers can be further formed outside the band-shaped Si pillars 15 aa and 15 bb in plan view. Thus, five Si pillars arranged in the X direction are formed. By repeating this step, a larger number of Si pillars arranged in the X direction can be formed. Si pillars that are unnecessary from the viewpoint of circuit design can be removed after the formation of the Si pillars 22 a to 22 f or can be removed by not forming any of the mask material layers 6 a, 16 a, and 16 b or by removing any of the mask material layers 6 a, 16 a, and 16 b after they are formed. Thus, Si pillars corresponding to the circuit design can be formed at high density.

3. This embodiment has been described using an example in which three Si pillars 22 a, 22 b, and 22 c and three Si pillars 22 d, 22 e, and 22 f are arranged at high density in the X direction. On the other hand, the same method of manufacture can be used to form Si pillars at high density in the Y direction. Si pillars can be simultaneously formed at high density in the X or Y direction depending on the circuit region by the method of manufacture provided by this embodiment. This allows for high-density circuit formation.

4. This embodiment has been described using an example in which the Si pillars 22 a and 22 d and the Si pillars 22 c and 22 f are formed on both sides of the Si pillars 22 b and 22 e. On the other hand, instead of the Si layer 15 in FIGS. 1HA to 1HC, the Si pillars 22 a and 22 d and the Si pillars 22 c and 22 f may be formed from other semiconductor material layers. Thus, the Si pillars 22 a and 22 d and Si pillars 22 c and 22 f can be formed from other semiconductor material layers. According to the present invention, semiconductor pillars can be formed from different semiconductor materials. This improves the flexibility of circuit design and thus provides a higher circuit performance.

5. In this embodiment, the width of the band-shaped mask material layers 16 a and 16 b in the X direction is equal to the width of the Si layer 15, which is formed on the side surfaces of the band-shaped SiGe pillars 10 aa and 10 bb by ALD. This means that the width of the band-shaped mask material layers 16 a and 16 b in the X direction can be changed by changing the time for deposition of the Si layer 15 by ALD. Thus, the Si pillars 22 a, 22 c, 22 d, and 22 f can be formed so as to have a different width in the X direction in plan view from the Si pillars 22 b and 22 e depending on the circuit design requirements. This provides a higher circuit performance.

Second Embodiment

A method for manufacturing a pillar-shaped semiconductor device having an SGT according to a second embodiment of the present invention will hereinafter be described with reference to FIGS. 2AA to 2CC, where the figures with the suffix A are plan views, the figures with the suffix B are sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix C are sectional structural views taken along line Y-Y′ of the figures with the suffix A. The steps of the method of manufacture according to the second embodiment are identical to those shown in the first embodiment except for the differences described below.

As shown in FIGS. 2AA to 2AC, instead of the band-shaped N+ layers 3 and 5 and P+ layer 4 in FIGS. 1AA to 1AC, P+ layers 50 a and 50 b and N+ layers 51 a and 51 b are formed so as to cross each other in plan view.

Next, as shown in FIGS. 2BA to 2BC, the same steps as those in FIGS. 1BA to 1MC are performed to form a band-shaped Si pillar 15 aa connected to the P+ layer 50 a and the N+ layer 51 b, a band-shaped Si pillar 8 connected to the N+ layer 51 a and the N+ layer 51 b, and a band-shaped Si pillars 15 bb connected to the N+ layer 51 a and the P+ layer 50 b in plan view. The band-shaped Si pillar 15 aa has a mask material layer 16 a formed thereon. The band-shaped Si pillar 8 has a mask material layer 6 a formed thereon. The band-shaped Si pillars 15 bb has a mask material layer 16 b formed thereon.

Next, the same steps as those in FIGS. 1NA to 1SC are performed. Thus, as shown in FIGS. 2CA to 2CC, a HfO2 layer 31 a surrounding the Si pillars 22 a to 22 f, a TiN layer 32AA surrounding the HfO2 layer 31 a and surrounding the outer peripheries of the Si pillars 22 a and 22 b, a TiN layer 32AB surrounding the outer periphery of the Si pillar 22 c, a TiN layer 32BA (not shown) surrounding the outer peripheries of the Si pillars 22 d and 22 e, and a TiN layer 32BB surrounding the outer periphery of Si pillar 22 f are formed. A SiN layer 39 is then formed around the outer peripheries of the top portions of the Si pillars 22 a to 22 f. A P+ layer 40A is then formed on the upper portion of the Si pillar 22 a. An N+ layer 40B is formed on the upper portion of the Si pillar 22 b. An N+ layer 40C is formed on the upper portion of the Si pillar 22 c. An N+ layer 40D (not shown) is formed on the upper portion of the Si pillar 22 d. An N+ layer 40E is formed on the upper portion of the Si pillar 22 e. A P+ layer 40F (not shown) is formed on the upper portion of the Si pillar 22 f. P+ layers 41A and 41F (not shown) are then formed so as to cover the P+ layers 40A and 40F by selective epitaxial crystal growth. Similarly, N+ layers 41B, 41C (not shown), 41D, and 41E are formed so as to cover the N+ layers 40B, 40C, 40D, and 40E by selective epitaxial crystal growth. Power supply line layers Vdd1 and Vdd2 are formed through contact holes 44 a and 44 d formed above the N+ layers 41A and 41F. A word line layer WL is formed through contact holes 44 b and 44 c formed above the TiN layers 32AB and 32BA. A SiO2 layer 47 having a flat upper surface is then formed so as to cover the entire surface. A ground line layer Vss is then formed through contact holes 46 a and 46 b formed above the P+ layers 41B and 41E. A SiO2 layer 48 having a flat upper surface is then formed so as to cover the entire surface. A bit output line layer BL and an inverted bit output line layer RBL are then formed through contact holes 49 a and 49 b formed above the N+ layers 41C and 41D. Thus, an SRAM cell circuit is formed on the P-layer substrate 1.

The method for manufacturing a pillar-shaped semiconductor device having an SGT according to this embodiment provides the following feature:

1. According to this embodiment, the SGTs formed at the Si pillars 22 b and 22 e, which are formed from the highly crystalline i layer 7, provide a higher on-current than the SGTs formed at the Si pillars 22 a, 22 c, 22 d, and 22 f, which are formed in the Si layer 15 formed by ALD. Accordingly, in the SRAM cell, drive SGTs, which require a higher drive current, are formed at the Si pillars 22 b and 22 e. Thus, a high-density, high-performance SRAM cell is formed.

Third Embodiment

A method for manufacturing a pillar-shaped semiconductor device having an SGT according to a third embodiment of the present invention will hereinafter be described with reference to FIGS. 3AA to 3DC, where the figures with the suffix A are plan views, the figures with the suffix B are sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix C are sectional structural views taken along line Y-Y′ of the figures with the suffix A. The steps of the method of manufacture according to the third embodiment are identical to those shown in the first embodiment except for the differences described below.

Instead of the N+ layers 3 and 5 and the P+ layer 4 in FIGS. 1AA to 1AC, a P+ layer (not shown) is formed over the entire surface, and the steps in FIGS. 1AA to 1MC are performed. As shown in FIGS. 3AA to 3AC, instead of the band-shaped mask material layers 20 a and 20 b, a band-shaped mask material layer 56 perpendicular to the band-shaped Si pillars 15 aa, 8, and 15 bb in plan view is formed. A P+ layer 55 is formed so as to be connected to the bottom portions of the band-shaped Si pillars 15 aa, 8, and 15 bb.

Next, the steps in FIGS. 1NA to 1OC are performed. Thus, as shown in FIGS. 3BA to 3BC, Si pillars 58 a, 58 b, and 58 c are formed on the P+ layer 55. The Si pillars 58 a, 58 b, and 58 c have mask material layers 57 a, 57 b, and 57 c formed thereon.

Next, the steps in FIGS. 1PA to 1SC are performed. Thus, as shown in FIGS. 3CA to 3CC, an N layer 2 b is formed on the P layer substrate 1, and a P+ layer 55 a is formed thereon. The Si pillars 58 a, 58 b, and 58 c are formed on the P+ layer 55 a. A SiO2 layer 30 a is then formed so as to surround the bottom portions of the Si pillars 58 a, 58 b, and 58 c. A HfO2 layer 60 is then formed around the outer peripheries of the Si pillars 58 a, 58 b, and 58 c and on the SiO2 layer 30 a. A TiN layer 61 is then formed so as to surround the HfO2 layer 60 on the side surfaces of the Si pillars 58 a, 58 b, and 58 c, and a W layer 62 connected to the Si pillars 58 a, 58 b, and 58 c in plan view are formed. The TiN layer 61 and the W layer 62 are formed by etching using a mask material layer 63, the mask material layers 57 a, 57 b, and 57 c, and SiN layers 34 aa, 34 bb, and 34 cc as a mask.

Next, the step in FIGS. 1TA to 1TC up to the formation of the SiN layer 39 is performed. As shown in FIGS. 3DA to 3DC, P+ layers 66 a, 66 b, and 66 c containing an acceptor impurity are then formed so as to cover the top portions of the Si pillars 58 a, 58 b, and 58 c by selective epitaxial growth. P+ layers 65 a, 65 b, and 65 c are then formed in the top portions of the Si pillars 58 a, 58 b, and 58 c by heat treatment. A SiO2 layer 67 is then formed so as to cover the entire surface. A drain line layer Vd is then formed through contact holes 68 a, 68 c, and 68 e formed above the P+ layers 66 a, 66 b, and 66 c. Similarly, a source line layer Vs is formed through a contact hole 68 b formed above the P+ layer 55 a. Similarly, a gate line layer Vg is formed through a contact hole 68 d formed above the W layer 62 connected to the TiN layer 61. Thus, three P-channel SGTs connected in parallel are formed on the P layer substrate 1.

The method for manufacturing a pillar-shaped semiconductor device having an SGT according to this embodiment provides the following feature:

2. In this embodiment, the Si pillars 58 a, 58 b, and 58 c are formed by performing the steps up to FIGS. 3AA to 3AC in the same manner as those shown in FIGS. 1AA to 1KC in the first embodiment such that the shape of the mask material layer 56 in FIGS. 3AA to 3AC in plan view differs from that of the mask material layers 20 a and 20 b shown in FIGS. 1KA to 1KC in the first embodiment. Thus, a high-density SRAM cell and three SGTs connected in parallel at high density can be simultaneously formed on the same P layer substrate 1.

Fourth Embodiment

A method for manufacturing a pillar-shaped semiconductor device having an SGT according to a fourth embodiment of the present invention will hereinafter be described with reference to FIGS. 4AA to 4BC, where the figures with the suffix A are plan views, the figures with the suffix B are sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix C are sectional structural views taken along line Y-Y′ of the figures with the suffix A. The steps of the method of manufacture according to the fourth embodiment are identical to those shown in the third embodiment except for the differences described below.

As shown in FIGS. 4AA to 4AC, instead of the mask material layer 56 in FIGS. 3AA to 3AC, a mask material layer 70 that is wider than the mask material layer 56 in the Y direction in plan view is formed.

Next, as shown in FIGS. 4BA to 4BC, the same steps as those of the third embodiment are performed to form three band-shaped Si pillars 71 a, 71 b, and 71 c on a P+ layer 55 b. A SiO2 layer 30 b is then formed so as to surround the bottom portions of the band-shaped Si pillars 71 a, 71 b, and 71 c. A HfO2 layer 60 a is then formed around the outer peripheries of the band-shaped Si pillars 71 a, 71 b, and 71 c and on the SiO2 layer 30 b. A TiN layer 61 a is then formed so as to surround the HfO2 layer 60 a on the side surfaces of the Si pillars 71 a, 71 b, and 71 c, and a W layer 62 a connected to the band-shaped Si pillars 71 a, 71 b, 71 c in plan view are formed. Next, a SiO2 layer 63 a is formed so as to surround the outer peripheries of the band-shaped Si pillars 71 a, 71 b, and 71 c, and a SiN layer 64 is formed on the SiO2 layer 63 a. Next, P+ layers 74 a, 74 b, and 74 c containing an acceptor impurity are formed so as to cover the top portions of the Si pillars 71 a, 71 b, and 71 c by selective epitaxial growth. P+ layers 73 a, 73 b, and 73 c are then formed in the top portions of the Si pillars 71 a, 71 b, and 71 c by heat treatment. A SiO2 layer 67 a is then formed so as to cover the entire surface. A drain line layer VDD is then formed through contact holes 75 a, 75 b, and 75 c formed above the P+ layers 74 a, 74 b, and 74 c. Similarly, a source line layer VSS is formed through a contact hole 75 b formed above the P+ layer 55 b. Similarly, a gate line layer VGG is formed through a contact hole 75 c formed above the W layer 62 a connected to the TiN layer 61 a. Thus, three P-channel SGTs connected in parallel are formed on the P layer substrate 1.

The method for manufacturing a pillar-shaped semiconductor device having an SGT according to this embodiment provides the following features:

3. According to this embodiment, the cross-sectional area of the band-shaped Si pillars 71 a, 71 b, and 71 c in plan view is larger than that of the Si pillars 58 a, 58 b, and 58 c in the third embodiment. Thus, the SGTs according to this embodiment can achieve a higher drive current than the SGTs according to the third embodiment.

4. In this embodiment, the SGTs can be easily formed so as to achieve the desired drive current by changing the length of the band-shaped Si pillars 71 a, 71 b, and 71 c in the Y direction in plan view.

Fifth Embodiment

A method for manufacturing a pillar-shaped semiconductor device having an SGT according to a fifth embodiment of the present invention will hereinafter be described with reference to FIGS. 5AA to 5CC, where the figures with the suffix A are plan views, the figures with the suffix B are sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix Care sectional structural views taken along line Y-Y′ of the figures with the suffix A. The steps of the method of manufacture according to the fifth embodiment are identical to those shown in the fourth embodiment except for the differences described below.

As shown in FIGS. 5AA to 5AC, as in the fourth embodiment, a band-shaped Si pillar 71 is formed on the P+ layer 4 a. A SiGe layer 10A is then formed so as to cover the entire surface by ALD such that the SiGe layer 10A is thinner than that of the fourth embodiment. The thin SiGe layer 10A can be formed since ALD allows SiGe atomic layers to be deposited layer by layer in a controlled manner.

Next, as shown in FIGS. 5BA to 5BC, the same steps as those of the fourth embodiment are performed to form band-shaped Si pillars 71 aa and 71 ca on both sides of a band-shaped Si pillar 71 ba. Thus, the band-shaped Si pillars 71 aa, 71 ba, and 71 ca are formed at a shorter distance than the band-shaped Si pillars 71 a, 71 b, and 71 c in the fourth embodiment.

Next, as shown in FIGS. 5CA to 5CC, the same steps as those of the fourth embodiment are performed to form a SiO2 layer 30 c so as to surround the bottom portions of the band-shaped Si pillars 71 aa, 71 ba, and 71 ca. A HfO2 layer 72 a is then formed around the outer peripheries of the band-shaped Si pillars 71 aa, 71 ba, and 71 ca and on the SiO2 layer 30 c. A TiN layer 61 b is then formed so as to surround the HfO2 layer 72 a. The TiN layer 61 b is formed so as to fill the spaces between the band-shaped Si pillars 71 aa, 71 ba, and 71 ca. Next, a SiO2 layer 63 b is formed so as to surround the outer peripheries of the band-shaped Si pillars 71 a, 71 b, and 71 c, and a SiN layer 64 b is formed on the SiO2 layer 63 b. Next, a P+ layer 80 containing an acceptor impurity is continuously formed so as to cover the top portions of the band-shaped Si pillars 71 aa, 71 ba, and 71 ca by selective epitaxial growth. P+ layers 73 aa, 73 ba, and 73 ca are then formed in the top portions of the Si pillars 71 aa, 71 ba, and 71 ca by heat treatment. A SiO2 layer 67 b is then formed so as to cover the entire surface. A drain line layer Vd is then formed through a contact hole 81 b formed above the P+ layer 80. Similarly, a source line layer Vs is formed through a contact hole 81 a formed above the P+ layer 55 aa. Similarly, a gate line layer Vg is formed through a contact hole 81 c formed above the TiN layer 61 b. Thus, three P-channel SGTs connected in parallel are formed on the P layer substrate 1.

The method for manufacturing a pillar-shaped semiconductor device having an SGT according to this embodiment provides the following features:

5. In this embodiment, the gate electrode material TiN layer 61 b reduces the distance between the band-shaped Si pillars 71 aa, 71 ba, and 71 ca so as to fill the spaces between the band-shaped Si pillars 71 aa, 71 ba, and 71 ca. Since the TiN layer 61 b covers the outer periphery of the gate insulating layer 60 b, normal transistor operation of SGTs is achieved. Thus, an SGT circuit in which three SGTs are connected in parallel at a higher density can be achieved.

In this embodiment, the P+ layer 80 is continuously formed over the P+ layers 73 aa, 73 ba, and 73 ca on the top portions of the band-shaped Si pillars 71 aa, 71 ba, and 71 ca by selective epitaxial growth. Thus, the contact hole 81 b can be formed over a larger area in plan view above the P+ layer 80. This allows the contact hole 81 b to be easily and accurately formed.

Sixth Embodiment

A method for manufacturing a pillar-shaped semiconductor device having an SGT according to a sixth embodiment of the present invention will hereinafter be described with reference to FIGS. 6AA to 6EC, where the figures with the suffix A are plan views, the figures with the suffix B are sectional structural views taken along line X-X′ of the figures with the suffix A, and the figures with the suffix C are sectional structural views taken along line Y-Y′ of the figures with the suffix A.

As shown in FIGS. 6AA to 6AC, after the steps up to FIGS. 1LA to 1LC in the first embodiment are performed, a SiGe layer (not shown) and a material layer (not shown) composed of a SiN layer, an Al2O3 layer, and a SiO2 layer are formed over the entire surface. The material layer is then subjected to lithography and RIE to form a band-shaped mask material layer 85 extending in the horizontal direction and composed of a SiN layer, an Al2O3 layer, and a SiO2 layer. The SiGe layer is then etched using the mask material layer 85 as a mask to form a band-shaped SiGe layer 86.

Next, the entire surface is covered with a SiN layer (not shown) by ALD. The entire surface is then covered with a SiO2 layer (not shown). The entire surface is then polished by CMP such that the upper surface is located at the same height as the upper surface of the mask material layer 85. The upper portion of the SiN layer is then etched to form recesses such that the bottom portions thereof are located at the same height as the bottom portion of the mask material layer 85. The entire surface is then covered with an Al2O3 layer. The Al2O3 layer is then polished to form mask material layers 87 a and 87 b made of the Al2O3 layer on both sides of the band-shaped mask material layer 85 such that the upper surfaces of the mask material layers 87 a and 87 b are located at the same height as the upper surface of the mask material layer 85. The SiO2 layer outside the SiGe layer 86 and the mask material layers 87 a and 87 b is then removed. The SiN layer is then etched using the mask material layers 85, 87 a, and 87 b as a mask to form band-shaped SiN layers 88 a and 88 b on both sides of the band-shaped SiGe layer 86.

Next, as shown in FIGS. 6CA to 6CC, the band-shaped mask material layer 85 and the band-shaped SiGe layer 86 are removed by etching.

Next, as shown in FIGS. 6DA to 6DC, the protective material layer 18, the mask material layer 6 a, and the band-shaped Si pillars 8, 15 aa, and 15 bb are etched using the mask material layers 87 a and 87 b and the SiN layers 88 a and 88 b as a mask. Thus, Si pillars 22 a, 22 b, 22 c, 22 d, 22 e, and 22 f are formed. By this etching, a mask material layer 16 aa, a protective material layer 18 a, the band-shaped SiN layer 88 a, and the band-shaped mask material layer 87 a are formed on the Si pillar 22 a. A mask material layer 6 aa, the protective material layer 18 a, the band-shaped SiN layer 88 a, and the band-shaped mask material layer 87 a are formed on the Si pillar 22 b. A mask material layer 16 ba, the protective material layer 18 a, the band-shaped SiN layer 88 a, and the band-shaped mask material layer 87 a are formed on the Si pillar 22 c. A mask material layer 16 ab (not shown), the protective material layer 18 a, the band-shaped SiN layer 88 b, and the band-shaped mask material layer 87 b are formed on the Si pillar 22 d. A mask material layer 6 bb, the protective material layer 18 b, the band-shaped SiN layer 88 b, and the band-shaped mask material layer 87 b are formed on the Si pillar 22 e. A mask material layer 16 bb, the protective material layer 18 b, the band-shaped SiN layer 88 b, and the band-shaped mask material layer 87 b are formed on the Si pillar 22 f. A SiO2 layer 19 a is formed under the band-shaped SiN layer 88 a between and outside the Si pillars 22 a, 22 b, and 22 c. Similarly, a SiO2 layer 19 b (not shown) is formed under the band-shaped SiN layer 88 b between and outside the Si pillars 22 d, 22 e, and 22 f.

Next, the mask material layers 87 a and 87 b, the SiN layers 88 a and 88 b, the SiO2 layers 19 a and 19 b, the protective material layers 18 a and 18 b, the band-shaped SiN layers 88 a and 88 b, and the band-shaped mask material layers 87 a and 87 b are removed. Thus, as shown in FIGS. 6EA to 6EC, the Si pillars 22 a to 22 f and the mask material layers 16 aa, 16 ba, 16 ab, 16 bb, 6 aa, and 6 bb on the top portions of the Si pillars 22 a to 22 f are left on the N+ layers 3 a, 3 b, 5 a, and 5 b and the P+ layers 4 a and 4 b. Thereafter, the steps from FIGS. 1PA to 1UC in the first embodiment are performed. Thus, an SRAM cell can be formed on the P-layer substrate 1.

The method for manufacturing a pillar-shaped semiconductor device having an SGT according to this embodiment provides the following features:

1. In this embodiment, the Si pillars 22 a to 22 f can not only be arranged at high density in the X direction, as in the first embodiment, but also be arranged at high density in the Y direction. Thus, an SRAM cell with a higher density can be achieved.

2. In this embodiment, after the band-shaped SiGe layer 86 is first formed, the SiN layers 88 a and 88 b are formed on both sides of the band-shaped SiGe layer 86. Thus, the two rows of Si pillars 22 a to 22 f can be formed at high density in the Y direction. If a band-shaped SiGe layer and a band-shaped SiN layer are formed outside the SiN layers 88 a and 88 b in plan view, four rows of Si pillars can be formed at high density in the Y direction. By repeating this step, an even number of rows of Si pillars including at least four rows can be formed in the Y direction.

3. In this embodiment, after the band-shaped SiGe layer 86 is first formed, the SiN layers 88 a and 88 b are formed on both sides of the band-shaped SiGe layer 86. On the other hand, a method in which, after a SiN layer is first formed, a SiGe layer is formed on both sides of the band-shaped SiN layer allows three rows of Si pillars to be formed in the Y direction. By repeating this step, an odd number of rows of Si pillars including at least three rows can be formed at high density in the Y direction.

Although SRAM circuits and circuits in which three SGTs are connected in parallel have been described by way of example in the embodiments according to the present invention, the present invention is also applicable to the formation of other circuits having SGTs.

Although one SGT is formed at one semiconductor pillar in the embodiments according to the present invention, the present invention is also applicable to the formation of circuits in which two or more SGTs are formed at one semiconductor pillar. This also applies to other embodiments according to the present invention.

In the first embodiment, the N+ layers 40 a, 40 c, 40 d, and 40 f and the P+ layers 40 b and 40 e, which contain donor and acceptor impurities, need not be formed on the top portions of the Si pillars 22 a to 22 f; instead, the N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e can function as the sources or drains of the SGTs. The N+ layers 40 a, 40 c, 40 d, and 40 f and the P+ layers 40 b and 40 e also function as the sources or drains of the SGTs when they are formed in the side surfaces of the top portions of the Si pillars 22 a to 22 f. The Si pillars 22 a to 22 f may also be formed such that the upper portions thereof are located at the same height as the upper ends of the gate TiN layers 32Aa and 32Ab, and the N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e may be formed on the top portions of the Si pillars 22 a to 22 f. The N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e may also be formed of, for example, a metal such as W or an alloy. This also applies to other embodiments according to the present invention.

In the first embodiment, as shown in FIGS. 1AA to 1AC, the mask material layer 6, which is composed of a SiO2 layer, an Al2O3 layer, and a SiO2 layer, is used as an etching mask. A material layer composed of a single layer or another combination of a plurality of layers may also be used as long as its purpose is achieved. These material layers may be inorganic or organic material layers. This also applies to other mask material layers 6 a, 6 aa, 6 ab, 16 a, 16 b, 16 aa, 16 bb, 16 ab, 16 ba, 20 a, 20 b, and 26 a to 26 d. This also applies to other embodiments according to the present invention.

In the first embodiment, the mask material layers 6, 6 a, 6 b, 6 aa, 6 bb, 16 aa, 16 ba, and 16 bb are assumed to have the same thickness; however, the surface layer becomes thinner during etching as the process proceeds. Accordingly, the selection of the constituent materials and the thicknesses of the mask material layers 6, 6 a, 6 b, 6 aa, 6 bb, 16 aa, 16 ba, and 16 bb are determined so that they deliver a predetermined function as mask material layers in their respective steps. This also applies to other embodiments according to the present invention.

In the first embodiment, as shown in FIGS. 1CA to 1CC, the SiGe layer 10 is formed so as to cover the band-shaped Si pillar 8 by ALD. The SiGe layer 10 may also be formed by another method such as molecular beam deposition, rather than by ALD. The SiGe layer 10 may also be replaced by another material layer that can be formed so as to have the same thickness on the side surfaces of the band-shaped Si pillar 8 and that can be removed after the formation of the band-shaped Si pillars 15 aa and 15 bb. This also applies to other embodiments according to the present invention.

Although the SGTs are formed on the P-layer substrate 1 in the first embodiment, the P-layer substrate 1 may be replaced by a silicon-on-insulator (SOI) substrate. This also applies to other embodiments according to the present invention.

In this embodiment, as shown in FIGS. 1CA to 1CC, the SiGe layer 10 is directly formed on the exposed side surfaces of the band-shaped Si pillar 8 and the surface layers of the N+ layers 3 a and 5 a and the P+ layer 4 a; instead, a thin SiO2 layer may be formed on the side surfaces of the band-shaped Si pillar 8 and the surface layers of the N+ layers 3 a and 5 a and the P+ layer 4 a before the formation of the SiGe layer 10. The SiO2 layer on the N+ layers 3 a and 5 a around the outer peripheries of the SiGe layers 10 a and 10 b may be removed before the formation of the Si layer 15, whereas the SiO2 layer on the side surfaces of the band-shaped Si pillar 8 may be removed before the formation of the gate insulating HfO2 layer 18. A material layer composed of a single layer other than a SiO2 layer or a plurality of layers may also be used. This also applies to other embodiments according to the present invention.

In the first embodiment, as shown in FIGS. 1OA to 1PC, a SiO2 layer (not shown) is formed in the side surfaces of the Si pillars 22 a to 22 f by isotropic oxidation, and the SiO2 layer is then removed so that the Si pillars 22 a to 22 f have a circular cross-section in plan view. This circular cross-section is intended to create as concentric a potential distribution as possible in the cross-section of the Si pillars 22 a to 22 f. This isotropic oxidation is not necessary if the cross-section need not be circular in terms of the required performance. The circular cross-section of the Si pillars 22 a to 22 f may also be formed by forming circular mask material layers 16 aa, 6 aa, 16 ba, 16 ab, 6 ab, and 16 bb. The circular cross-section may also be oval. This also applies to other embodiments according to the present invention.

Although the HfO2 layer 31 is used as a gate insulating layer and the TiN layer 32 is used as a gate material layer in the first embodiment, each of them may be another material layer composed of a single layer or a plurality of layers. Similarly, the W layer 34 may be another material layer composed of a single layer or a plurality of layers. This also applies to other embodiments according to the present invention.

In the first embodiment, the N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e shown in FIGS. 1TA to 1TC are formed by selective epitaxial crystal growth. The N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e need not be formed by CVD, but may instead be formed by another method that allows selective epitaxial crystal growth, such as, for example, molecular beam deposition, ALD, or liquid phase epitaxy. This also applies to other embodiments according to the present invention.

In the first embodiment, the N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e shown in FIGS. 1TA to 1TC are formed by selective epitaxial crystal growth. The N+ layers 41 a, 41 c, 41 d, and 41 f and the P+ layers 41 b and 41 e may also be formed by normal epitaxial crystal growth followed by lithography and etching. This also applies to other embodiments according to the present invention.

In the first embodiment, as shown in FIGS. 1UA to 1UC, the N+ layers 40 a, 40 c, 40 d, and 40 f and the P+ layers 40 b and 40 e are formed such that the lower ends thereof are located at the same height as the upper ends of the TiN layers 32Aa, 32Ab, 32Ba, and 32Bb, which are gate conductor layers, in the perpendicular direction. Although it is desirable that the bottom portions of the lower ends of the N+ layers 40 a, 40 c, 40 d, and 40 f and the P+ layers 40 b and 40 e be located at the same height as the upper ends of the gate TiN layers 32Aa, 32Ab, 32Ba, and 32Bb, they may be located slightly above or below the upper ends of the gate TiN layers 32Aa, 32Ab, 32Ba, and 32Bb as long as there is no problem with the operation of the SGTs. The same also applies to the relationship between the N+ layers 3 aa, 5 aa, 3 ab, and 5 ab and the P+ layers 4 aa and 4 ab and the gate TiN layers 32Aa, 32Ab, 32Ba, and 32Bb. This also applies to other embodiments according to the present invention.

In the first embodiment, a configuration in which the Si pillars 22 a and 22 d and the Si pillars 22 c and 22 f are formed on both sides of the Si pillars 22 b and 22 e has been described by way of example. On the other hand, the method of manufacture according to this embodiment can be used to form new Si pillars outside both sides of the Si pillars 22 a and 22 d and the Si pillars 22 c and 22 f. This also applies to other embodiments according to the present invention.

In the first embodiment, a configuration in which the Si pillars 22 a and 22 d and the Si pillars 22 c and 22 f are formed on both sides of the Si pillars 22 b and 22 e has been described by way of example. On the other hand, any of the Si pillars 22 a to 22 f that have been formed may be removed by lithography and etching depending on the circuit design. This also applies to other embodiments according to the present invention.

In the first embodiment, SGTs in which the sources and the drains are formed on the upper and lower sides of the Si pillars 22 a to 22 f using the N+ layers 40 a, 40 c, 40 d, and 40 f, the P+ layers 40 b and 40 e, the N+ layers 3 aa, 5 aa, 3 ab, and 5 ab, and the P+ layers 4 aa and 4 ab, which have conductivity of the same polarity, have been described; instead, the present invention is also applicable to tunneling SGTs having sources and drains of different polarities. This also applies to other embodiments according to the present invention.

In the foregoing embodiments, an example in which silicon (Si) is used as semiconductor regions such as channels, sources, and drains in semiconductor pillars has been described. However, the technical idea of the present invention is not limited thereto, but is also applicable to semiconductor devices having SGTs using Si-containing semiconductor materials such as SiGe or semiconductor materials other than Si.

In vertical NAND-type flash memory circuits, semiconductor pillars are used as channels, and memory cells composed of a tunneling oxide layer, a charge storage layer, an interlayer insulating layer, and a control conductor layer surrounding the semiconductor pillars are formed in multiple stages in the perpendicular direction. The semiconductor pillars at both ends of the memory cells have a source line impurity layer corresponding to the source and a bit line impurity layer corresponding to the drain. If one of the memory cells on both sides of one memory cell functions as a source, the other functions as a drain. Thus, vertical NAND-type flash memory circuits are one type of SGT circuit. Accordingly, the present invention is also applicable to NAND-type flash memory circuits.

Various embodiments of the present invention and modifications thereof are possible without departing from the broad spirit and scope of the present invention. The foregoing embodiments are given to describe an example of the present invention and are not intended to limit the scope of the present invention. The foregoing examples and modifications can be combined in any manner. Furthermore, the foregoing embodiments fall within the scope of the technical idea of the present invention even if some elements are excluded from those embodiments as needed.

The methods for manufacturing a pillar-shaped semiconductor device according to the present invention provide high-density pillar-shaped semiconductor devices. 

What is claimed is:
 1. A method for manufacturing a pillar-shaped semiconductor device, comprising the steps of: forming a first mask material layer extending in a band shape in one direction in plan view on a semiconductor layer on a substrate; etching the semiconductor layer using the first mask material layer as a mask to form a first band-shaped semiconductor pillar; forming a first material layer so as to cover the first mask material layer, the first band-shaped semiconductor pillar, and a portion of the substrate around an outer periphery of the first band-shaped semiconductor pillar; forming a second material layer so as to cover the first material layer; planarizing the first material layer and the second material layer such that upper surfaces thereof are located at the same height as an upper surface of the first mask material layer; etching a top portion of the first material layer using the first mask material layer and the second material layer as a mask to form first recesses; forming a second mask material layer so as to fill the first recesses above the top portion of the first material layer and such that an upper surface of the second mask material layer is located at the same height as the upper surface of the first mask material layer; removing the second material layer; etching the first material layer using the first mask material layer and the second mask material layer as a mask to form a first band-shaped material pillar and a second band-shaped material pillar based on the first material layer on both sides of the first band-shaped semiconductor pillar in plan view; forming a first semiconductor layer so as to cover the first mask material layer, the second mask material layer, the first band-shaped semiconductor pillar, the first band-shaped material pillar, the second band-shaped material pillar, and the substrate; forming a third material layer so as to cover the first semiconductor layer; planarizing the first semiconductor layer and the third material layer such that upper surfaces thereof are located at the same height as the upper surface of the first mask material layer; etching a top portion of the first semiconductor layer using the first mask material layer, the second mask material layer, and the third material layer as a mask to form second recesses; forming a third mask material layer so as to fill the second recesses above the top portion of the first semiconductor layer and such that an upper surface of the third mask material layer is located at the same height as the upper surface of the first mask material layer; removing the third material layer; etching the first semiconductor layer using the first mask material layer, the second mask material layer, and the third mask material layer as a mask to form a second band-shaped semiconductor pillar and a third band-shaped semiconductor pillar based on the first semiconductor layer outside the first band-shaped material pillar and the second band-shaped material pillar in plan view; removing the first band-shaped material pillar and the second band-shaped material pillar; forming a fourth material layer around outer peripheries of the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar such that an upper surface of the fourth material layer is located at the same height as the upper surface of the first mask material layer; forming a fourth mask material layer extending in a band shape on the first mask material layer, the third mask material layer, and the fourth material layer in a direction perpendicular to the direction in which the first mask material layer extends in a band shape in plan view; and etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using the fourth mask material layer as a mask to form a first semiconductor pillar, a second semiconductor pillar, and a third semiconductor pillar, wherein pillar-shaped semiconductor devices having channels in the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar are formed.
 2. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, wherein the second band-shaped semiconductor pillar and the third band-shaped semiconductor pillar are formed from a second semiconductor base different from a first semiconductor base for the first band-shaped semiconductor pillar.
 3. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, wherein one of the first mask material layer and the second mask material layer is formed so as to be wider than the other in plan view.
 4. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, wherein one of the first mask material layer and the third mask material layer is formed so as to be wider than the other in plan view.
 5. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, wherein one of the first mask material layer and the fourth mask material layer is formed so as to be wider than the other in plan view.
 6. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, comprising the steps of: forming a gate insulating layer so as to surround side surfaces of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar; and forming a gate conductor layer so as to surround the gate insulating layer, wherein the gate conductor layer is formed so as to fill spaces between the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar.
 7. The method for manufacturing a pillar-shaped semiconductor device according to claim 6, wherein a semiconductor layer containing a donor or acceptor impurity is formed by epitaxial growth, the semiconductor layer covering top portions of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar, or having a lower end thereof located at an upper portion of the gate conductor layer in a perpendicular direction and being in contact with and connected to the side surfaces of the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar.
 8. The method for manufacturing a pillar-shaped semiconductor device according to claim 1, comprising the steps of: forming a fifth material layer around the outer peripheries of the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar such that an upper surface of the fifth material layer is located at the same height as the upper surface of the first mask material layer; forming a third band-shaped material pillar having a fifth mask material layer on a top portion thereof on the first mask material layer, the third mask material layer, and the fifth material layer, the third band-shaped material pillar being perpendicular to the first band-shaped semiconductor pillar in plan view; forming a fourth band-shaped material pillar having a sixth mask material layer on a top portion thereof on one side of the third band-shaped material pillar and a fifth band-shaped material pillar having a seventh mask material layer on a top portion thereof on the other side of the third band-shaped material pillar; removing the fifth mask material layer and the third band-shaped material pillar; and etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using one or both of the sixth mask material layer and the fourth band-shaped material pillar as a mask to form the first semiconductor pillar, the second semiconductor pillar, and the third semiconductor pillar while etching the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar using one or both of the seventh mask material layer and the fifth band-shaped material pillar as a mask to form a fourth semiconductor pillar, a fifth semiconductor pillar, and a sixth semiconductor pillar in regions where the seventh mask material layer intersects the first band-shaped semiconductor pillar, the second band-shaped semiconductor pillar, and the third band-shaped semiconductor pillar in plan view, wherein the sixth mask material layer and the seventh mask material layer have the same width in plan view. 